- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
Patent holdings for IPC class H01L 23/12
Total number of patents in this class: 4049
10-year publication summary
|
236
|
219
|
261
|
310
|
286
|
270
|
223
|
294
|
211
|
76
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Murata Manufacturing Co., Ltd. | 22355 |
373 |
| Kyocera Corporation | 12735 |
224 |
| Intel Corporation | 45621 |
148 |
| Mitsubishi Electric Corporation | 43934 |
127 |
| Mitsubishi Materials Corporation | 2378 |
102 |
| NEC Corporation | 32703 |
98 |
| Rohm Co., Ltd. | 5843 |
83 |
| Panasonic Corporation | 20786 |
82 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
80 |
| Sony Semiconductor Solutions Corporation | 8770 |
62 |
| Sumitomo Bakelite Co., Ltd. | 1416 |
55 |
| Fuji Electric Co., Ltd. | 4750 |
49 |
| Renesas Electronics Corporation | 6305 |
47 |
| LG Innotek Co., Ltd. | 6758 |
44 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
43 |
| Samsung Electronics Co., Ltd. | 131630 |
41 |
| Texas Instruments Incorporated | 19376 |
38 |
| Showa Denko Materials Co., Ltd. | 629 |
36 |
| Sony Corporation | 32931 |
35 |
| Toppan Printing Co., Ltd. | 2212 |
34 |
| Other owners | 2248 |